IEEE RAS in Automotive Summit
Conference intro:
A new international industry-focused summit that brings together academic researchers and industry technology leaders to share their vision and thought-leadership on the toughest Reliability, Availability and Serviceability (RAS) challenges facing the automotive market now and in the future. Emphasizing end-use and market ready solutions, RAS in Automotive is sponsored by the IEEE Computer Society in coordination with the Test Technology Technical Community (TTTC).
December 5-6, 2024
Politecnico Di Torino in Italy
Announcements
For this first inaugural edition of the summit, in addition to Keynotes, Panels and Invited Tutorials, the event will also feature demos from the industry, as well as presentations in the area of automotive RAS.
As space is limited, registration will be made available on a rolling basis by invitation only. If you’re interested in attending, please join the waitlist. If you will need a Visa letter to attend, contact Carmen Saliba ([email protected]) with your request.
Topic Areas
- Automotive Design-for-Test: enable high quality at low cost
- Built-In Self-Test in automotive systems: Digital, analog, mixed-signal
- Power-up, power-down and periodic test
- Dependability challenges of autonomous driving and e-mobility
- Aging effects on automotive electronics
- Fault tolerance and self-checking circuits
- Functional safety and cyber-security
- Functional and structural test generation
- Automotive standards and certification
- Verification and validation of automotive systems
- Statistical post-processing
- Machine Learning, and AI for testing and reliability
- Reuse of test infrastructure and New Product Development acceleration
- System Level Test of Automotive System-on-Chip
- On-Line Testing and repair strategies
- Silicon Lifecycle management
- SLM monitoring strategies
- Telemetry and Predictive Maintenance
- Advanced packaging and Chiplet technology
- Packaging Equipment and Test Equipment
- Reliability of Systems in Package
- Reliability of Power modules for Automotive
- Design for Test and Reliability of power modules
- Reliability Analysis and ISO Standardizations
- Reliability of AI Architectures for Automotive
- Design for Test of AI HW Accelerators
- Reliability assessment of AI computations
Key Dates
- Submission deadline: October 25, 2024
- Notification of acceptance: November 12, 2024
Sponsor
